Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.The cleaning was done using a SUSS MicroTec CL300 cleaner module (manual puddle dispense) on an XBC300 cluster platform while bonding was performed on a SUSS MicroTec CB200 Bonder. The wafer was puddled with the selectedanbsp;...
| Title | : | Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele |
| Author | : | C. Colinge |
| Publisher | : | The Electrochemical Society - 2010-10-01 |
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